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CSP test socket equipped with adjustable pressure pads

CSP test socket equipped with adjustable pressure pads.

The CSP (Chip Scale Package) / Micro BGA (Ball Grid Array) test burn-in socket product series from Aries features a simple pressure pad compression design that accommodates various ranges of movement without applying excessive pressure to the device. It offers devices with maximum sizes of 6.5 mm², 13 mm², 27 mm², 40 mm², 55 mm², as well as 14 to 27 mm².